Browsing by author "de Marneffe, Jean-Francois"
Now showing items 1-20 of 213
-
28nm pitch of line/space pattern transfer into silicon substrates with chemo-epitaxy directed self-assembly (DSA) process flow
Chan, BT; Tahara, Shigeru; Parnell, Doni; Rincon Delgadillo, Paulina; Gronheid, Roel; de Marneffe, Jean-Francois; Xu, Kaidong; Nishimura, Eiichi; Werner, Thilo (2013) -
2D TMDC aging: a case study of monolayer WS2 and mitigation strategies
Wyndaele, Pieter-Jan; de Marneffe, Jean-Francois; Slaets, R.; Groven, Benjamin; Franquet, Alexis; Bruener, P.; Grehl, T.; De Gendt, Stefan (2024) -
30-nm half-pitch metal patterning using MotifTM critical dimension shrink technique and double patterning
Versluijs, Janko; de Marneffe, Jean-Francois; Goossens, Danny; Vandeweyer, Tom; Wiaux, Vincent; Struyf, Herbert; Maenhoudt, Mireille; Brouri, Mohand; Vertommen, Johan; Kim, Ji Soo; Zhu, Helen; Sadjadi, Reza (2009) -
30nm half-pitch metal patterning using MotifTM CD shrink technique and double patterning
Versluijs, Janko; de Marneffe, Jean-Francois; Goossens, Danny; Op de Beeck, Maaike; Vandeweyer, Tom; Wiaux, Vincent; Struyf, Herbert; Maenhoudt, Mireille; Brouri, Mohand; Vertommen, Johan; Kim, Ji Soo; Zhu, Helen; Sadjadi, Reza (2008) -
A 0.314mm2 6T-SRAM cell built with tall triple-gate devices for 45nm node applications using 0.75NA 193nm lithography
Nackaerts, Axel; Ercken, Monique; Demuynck, Steven; Lauwers, Anne; Baerts, Christina; Bender, Hugo; Boullart, Werner; Collaert, Nadine; Degroote, Bart; Delvaux, Christie; de Marneffe, Jean-Francois; Dixit, Abhisek; De Meyer, Kristin; Hendrickx, Eric; Heylen, Nancy; Jaenen, Patrick; Laidler, David; Locorotondo, Sabrina; Maenhoudt, Mireille; Moelants, Myriam; Pollentier, Ivan; Ronse, Kurt; Rooyackers, Rita; Van Aelst, Joke; Vandenberghe, Geert; Vandervorst, Wilfried; Vandeweyer, Tom; Vanhaelemeersch, Serge; Van Hove, Marleen; Van Olmen, Jan; Verhaegen, Staf; Versluijs, Janko; Vrancken, Christa; Wiaux, Vincent; Jurczak, Gosia; Biesemans, Serge (2004-12) -
A DC-pulsed capacitively-coupled planar Langmuir probe for plasma process diagnostics and monitoring
Samara, Vladimir; Booth, Jean-Paul; de Marneffe, Jean-Francois; Milenin, Alexey; Brouri, Mohand; Boullart, Werner (2012) -
A metal hardmask approach for the contact patterning of a 0.186 μm² SRAM cell exposed with EUV lithography
de Marneffe, Jean-Francois; Goossens, Danny; Vandervorst, Alain; Demuynck, Steven; Goethals, Mieke; Hermans, Jan; Van Roey, Frieda; Baudemprez, Bart; Brus, Stephan; Vrancken, Christa (2008) -
A novel low temperature etch approach to reduce ULK plasma damage
Zhang, Liping; de Marneffe, Jean-Francois; Leroy, F.; Ljazouli, R.; Lefaucheux, P.; Tillocher, T; Dussart, R.; Maekawa, K.; Yatsuda, K.; Dussarrat, C.; De Gendt, Stefan; Baklanov, Mikhaïl (2015) -
A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond
Op de Beeck, Maaike; Versluijs, Janko; Tokei, Zsolt; Demuynck, Steven; de Marneffe, Jean-Francois; Boullart, Werner; Vanhaelemeersch, Serge; Zhu, Helen; Cirigliano, Peter; Pavel, Elisabeth; Sadjadi, Reza; Kim, Jisoo (2007) -
A Novel Volatile Film for Dielectric Plasma Damage Protection
de Marneffe, Jean-Francois; Rezvanov, Askar; Chanson, Romain; Babaei Gavan, Khashayar; Fujikawa, M.; Yamaguchi, T.; Nozawa, S.; Kikuchi, Y.; Maekawa, K. (2019) -
A route towards the fabrication of 2D heterostructures using atomic layer etching combined with selective conversion
Heyne, Markus; Marinov, Daniil; Braithwaite, Nicholas; Goodyear, Andy; de Marneffe, Jean-Francois; Cooke, Mike; Radu, Iuliana; Neyts, Erik C.; De Gendt, Stefan (2019) -
Adsorption isobars of fluorocarbon compounds for cryogenic plasma etching of low-k dielectrics (in Russian)
Rezvanov, A.; Gutshin, O.; Gornev, E.; Krasnikov, G.; Mogil'nikov, K.; Zhang, Liping; de Marneffe, Jean-Francois; Dussarat, C.; Baklanov, Mikhaïl (2015) -
Adsorption isobars of fluorocarbon compounds selected for cryogenic etching of low-k materials
Rezvanov, A.; Mogilnikov, K.; Gutshin, O.; Gornev, E.; Krasnikov, G.; Zhang, Liping; Dussarrat, C.; de Marneffe, Jean-Francois; Baklanov, Mikhaïl (2015) -
Advanced CMOS manufacturing, a drive for plasma science and technology
de Marneffe, Jean-Francois; Altamirano Sanchez, Efrain; Milenin, Alexey; Samara, Vladimir; Boullart, Werner; Baklanov, Mikhaïl (2012) -
Advanced etching for nanodevices and 2D materials
de Marneffe, Jean-Francois; Cooke, Mike; Goodyear, Andy; Braithwaite, Nicolas; Sutton, Yvonne; Bowden, Mark; Altamirano Sanchez, Efrain; Zotovich, Alexey; El Otell, Ziad; Chan, BT; Knoll, Armin; Rawlings, Colin; Duerig, Urs; Spiesser, Martin; Kaestner, Marcus; Neuber, Christian; Rangelow, Ivo (2016) -
Advances and challenges in ultra low-k patterning
Xu, Kaidong; Souriau, Laurent; Lazzarino, Frederic; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Boullart, Werner (2012) -
ALD Encapsulation of CVD WS2 for Stable and High-Performance FET Devices
Wu, Xiangyu; Lin, Dennis; Cott, Daire; De Marneffe, Jean-Francois; Groven, Benjamin; Sergeant, Stefanie; Shi, Yuanyuan; Smets, Quentin; Sutar, Surajit; Asselberghs, Inge; Radu, Iuliana (2021) -
Alternative integration of ultra low-k dielectrics by template replacement approach
Zhang, Liping; de Marneffe, Jean-Francois; Heylen, Nancy; Murdoch, Gayle; Tokei, Zsolt; Boemmels, Juergen; De Gendt, Stefan; Baklanov, Mikhaïl (2015) -
An experimental study of VUV plasma damage on porous organo-silicon glass materials
de Marneffe, Jean-Francois; Lukaszewicz, Mikolaj; Heyne, Markus; Zhang, Liping; Baklanov, Mikhaïl (2013-02) -
Anisotropic properties of Bi-2201 thin films grown on vicinal substrates
Zhang, Y.Z.; Wang, Z.; Zheng, D.N.; Wen, H.H.; Zhao, Z.X.; de Marneffe, Jean-Francois; Deltour, R.; Jansen, A.G.M.; Wyder, P. (2005-05)