Authors

Phommahaxay, Alain; Guerrero, Alice; Kennes, Koen; Podpod, Arnita; Brems, Steven; Slabbekoorn, John; Tussing, Sebastian; Spiess, Walter; Penger, Luke; Yess, Kim; Arnold, Kim; Rapps, Thomas; Lutter, Stefan; Sleeckx, Erik; Huyghebaert, Cedric; Asselberghs, Inge; Miller, Andy; Beyer, Gerald; Radu, Iuliana; Beyne, Eric

Conference

2019 International Wafer Level Packaging Conference (IWLPC)

Title

The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics

Publication type

Proceedings paper

Embargo date

9999-12-31