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The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics
Publication:
The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics
Date
2019
Proceedings Paper
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44316.pdf
1.07 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Phommahaxay, Alain
;
Guerrero, Alice
;
Kennes, Koen
;
Podpod, Arnita
;
Brems, Steven
;
Slabbekoorn, John
;
Tussing, Sebastian
;
Spiess, Walter
;
Penger, Luke
;
Yess, Kim
;
Arnold, Kim
;
Rapps, Thomas
;
Lutter, Stefan
;
Sleeckx, Erik
;
Huyghebaert, Cedric
;
Asselberghs, Inge
;
Miller, Andy
;
Beyer, Gerald
;
Radu, Iuliana
;
Beyne, Eric
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Abstract
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1956
since deposited on 2021-10-27
439
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations
Metrics
Views
1956
since deposited on 2021-10-27
439
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations