Publication:

The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics

Date

2019
Proceedings Paper
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dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorGuerrero, Alice
dc.contributor.authorKennes, Koen
dc.contributor.authorPodpod, Arnita
dc.contributor.authorBrems, Steven
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorTussing, Sebastian
dc.contributor.authorSpiess, Walter
dc.contributor.authorPenger, Luke
dc.contributor.authorYess, Kim
dc.contributor.authorArnold, Kim
dc.contributor.authorRapps, Thomas
dc.contributor.authorLutter, Stefan
dc.contributor.authorSleeckx, Erik
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorAsselberghs, Inge
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorRadu, Iuliana
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorAsselberghs, Inge
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorRadu, Iuliana
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecRadu, Iuliana::0000-0002-7230-7218
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T16:02:36Z
dc.date.available2021-10-27T16:02:36Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33795
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8914124
dc.source.conference2019 International Wafer Level Packaging Conference (IWLPC)
dc.source.conferencedate13/10/2019
dc.source.conferencelocationSan Jose, CA USA
dc.title

The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics

dc.typeProceedings paper
dspace.entity.typePublication
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