Authors

Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Kennes, Koen; Bertheau, Julien; Arumugam, Hariharan; Cochet, Tom; Rebibis, Kenneth June; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric

Conference

2019 International Wafer Level Packaging Conference (IWLPC)

Title

Novel temporary bonding and debonding solutions enabling an ultrahigh interconnect density FO-WLP structure assembly with quasi-zero die shift

Publication type

Proceedings paper

Embargo date

9999-12-31