Authors

Daily, Robert; Capuz, Giovanni; Wang, Teng; Bex, Pieter; Struyf, Herbert; Sleeckx, Erik; Demeurisse, Caroline; Attard, A.; Eberharter, W.; Klingler, H.

Conference

International Conference on Electronic Packaging & iMAPS All Asia Conference - ICEP-IACC

Title

3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly

Publication type

Meeting abstract

Embargo date

9999-12-31