Publication:

3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly

Date

2015
Meeting abstract
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dc.contributor.authorDaily, Robert
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorWang, Teng
dc.contributor.authorBex, Pieter
dc.contributor.authorStruyf, Herbert
dc.contributor.authorSleeckx, Erik
dc.contributor.authorDemeurisse, Caroline
dc.contributor.authorAttard, A.
dc.contributor.authorEberharter, W.
dc.contributor.authorKlingler, H.
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorDemeurisse, Caroline
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.date.accessioned2021-10-22T18:47:29Z
dc.date.available2021-10-22T18:47:29Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25119
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7111000
dc.source.beginpage56
dc.source.conferenceInternational Conference on Electronic Packaging & iMAPS All Asia Conference - ICEP-IACC
dc.source.conferencedate14/04/2015
dc.source.conferencelocationKyoto Japan
dc.source.endpage60
dc.title

3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly

dc.typeMeeting abstract
dspace.entity.typePublication
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