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Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G
Publication:
Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G
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Date
2022
Proceedings Paper
https://doi.org/10.1109/ECTC51906.2022.00009
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sun, Xiao
;
Slabbekoorn, John
;
Sinha, Siddhartha
;
Bex, Pieter
;
Pinho, Nelson
;
Webers, Tomas
;
Velenis, Dimitrios
;
Miller, Andy
;
Collaert, Nadine
;
Van der Plas, Geert
;
Beyne, Eric
Journal
na
Abstract
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Acq. date: 2025-12-13
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Views
1453
since deposited on 2022-09-17
2
last month
Acq. date: 2025-12-13
Citations