Publication:

Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G

Date

2022
Proceedings Paper
https://doi.org/10.1109/ECTC51906.2022.00009
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dc.contributor.authorSun, Xiao
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorSinha, Siddhartha
dc.contributor.authorBex, Pieter
dc.contributor.authorPinho, Nelson
dc.contributor.authorWebers, Tomas
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorMiller, Andy
dc.contributor.authorCollaert, Nadine
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorSinha, Siddhartha
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorPinho, Nelson
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSinha, Siddhartha::0000-0003-4025-2854
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2023-04-27T15:05:44Z
dc.date.available2022-09-17T02:52:06Z
dc.date.available2023-04-27T15:05:44Z
dc.date.issued2022
dc.identifier.doi10.1109/ECTC51906.2022.00009
dc.identifier.eisbn978-1-6654-7943-1
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40440
dc.publisherIEEE
dc.source.beginpage7
dc.source.conference72nd IEEE Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 31-JUN 01, 2022
dc.source.conferencelocationSan Diego
dc.source.endpage11
dc.source.journalna
dc.source.numberofpages5
dc.title

Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G

dc.typeProceedings paper
dspace.entity.typePublication
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