Browsing by author "Slabbekoorn, John"

3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network

Sun, Xiao; Lin, Hesheng; Velenis, Dimitrios; Slabbekoorn, John; Talmelli, Giacomo; Bex, Pieter; Sterken, Tom; Lauwereins, Rudy; Adelmann, Christoph; Miller, Andy; Van der Plas, Geert; Beyne, Eric (2020)

3D stacking using bump-less process for sub 10μm pitches

Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016)

A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch

Podpod, Arnita; Slabbekoorn, John; Phommahaxay, Alain; Duval, Fabrice; Salahouelhadj, Abdellah; Gonzalez, Mario; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018)

Advances in Photosensitive Polymer Based Damascene RDL Processes: Toward Submicrometer Pitches With More Metal Layers

Chery, Emmanuel; Slabbekoorn, John; Pinho, Nelson; Miller, Andy; Beyne, Eric (2021)

Advances in temporary carrier technology for high density fan-out device build-up

Podpod, Arnita; Phommahaxay, Alain; Bex, Pieter; Slabbekoorn, John; Bertheau, Julien; Salahouelhadj, Abdellah; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric; Guerrero, Alice; Yess, Kim; Arnold, Kim (2019)

An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem

Noda, Hiroto; Hiro, Akito; Nishiguchi, Naoki; Derakhshandeh, Jaber; Slabbekoorn, John; Beyne, Eric (2023)

Broadband Characterization of Polymers under Reliability Stresses and Impact of Capping Layer

Pantano, Nicolas; Chery, Emmanuel; Op de Beeck, Maaike; Slabbekoorn, John; Beyne, Eric (2022)

Broadband permittivity characterization of polymers up to 110GHz using co-planar waveguides

Pantano, Nicolas; Slabbekoorn, John; Duval, Fabrice; Beyne, Eric (2021)

Cobalt UBM for fine pitch microbump applications in 3DIC

Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Dictus, Dries; Di Piazza, Luca; Hou, Lin; Guerrieri, Stefano; Vakanas, George; Armini, Silvia; Daily, Robert; Lesniewska, Alicja; Vandelaer, Yannick; Van De Peer, Myriam; Slabbekoorn, John; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015)

Cost components for 3D system integration

Velenis, Dimitrios; Detalle, Mikael; Van Huylenbroeck, Stefaan; Jourdain, Anne; Phommahaxay, Alain; Slabbekoorn, John; Wang, Teng; Rebibis, Kenneth June; Marinissen, Erik Jan; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014)

Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G

Sun, Xiao; Slabbekoorn, John; Sinha, Siddhartha; Bex, Pieter; Pinho, Nelson; Webers, Tomas; Velenis, Dimitrios; Miller, Andy; Collaert, Nadine; Van der Plas, Geert; Beyne, Eric (2022)

Creating 1 $lm RDL structures for fan-out wafer-level packaging

Flack, Warren; Slabbekoorn, John (2018)

Defect learning methodology applied to microbump process at 20μm pitch and below

Liebens, Maarten; Slabbekoorn, John; Miller, Andy; Beyne, Eric; Stoerring, M.; Hiebert, S.; Cross, A. (2018)

Demonstration of a collective hybrid die-to-wafer integration

Suhard, Samuel; Phommahaxay, Alain; Kennes, Koen; Bex, Pieter; Fodor, Ferenc; Beyne, Eric; Liebens, Maarten; Slabbekoorn, John; Miller, Andy; Beyer, Gerald (2020)

Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring

Suhard, Samuel; Iwasaki, Akihisa; Liebens, Maarten; Stiers, Karen; Slabbekoorn, John; Holsteyns, Frank (2016)

Die to wafer 3D stacking for below 10μm pitch microbumps

Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Suhard, Samuel; Dubey, Vikas; Jamieson, Geraldine; Inoue, Fumihiro; Webers, Tomas; Bex, Pieter; Capuz, Giovanni; Beyne, Eric; Slabbekoorn, John; Wang, Teng; Jourdain, Anne; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy (2016)