dc.contributor.author | Sun, Xiao | |
dc.contributor.author | Slabbekoorn, John | |
dc.contributor.author | Sinha, Siddhartha | |
dc.contributor.author | Bex, Pieter | |
dc.contributor.author | Pinho, Nelson | |
dc.contributor.author | Webers, Tomas | |
dc.contributor.author | Velenis, Dimitrios | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Collaert, Nadine | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2023-04-27T15:05:44Z | |
dc.date.available | 2022-09-17T02:52:06Z | |
dc.date.available | 2023-04-27T15:05:44Z | |
dc.date.issued | 2022 | |
dc.identifier.issn | 0569-5503 | |
dc.identifier.other | WOS:000848765300002 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40440.2 | |
dc.source | WOS | |
dc.title | Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Sun, Xiao | |
dc.contributor.imecauthor | Slabbekoorn, John | |
dc.contributor.imecauthor | Sinha, Siddhartha | |
dc.contributor.imecauthor | Bex, Pieter | |
dc.contributor.imecauthor | Pinho, Nelson | |
dc.contributor.imecauthor | Webers, Tomas | |
dc.contributor.imecauthor | Velenis, Dimitrios | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Collaert, Nadine | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Sinha, Siddhartha::0000-0003-4025-2854 | |
dc.contributor.orcidimec | Bex, Pieter::0000-0003-0896-2514 | |
dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
dc.contributor.orcidimec | Collaert, Nadine::0000-0002-8062-3165 | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.identifier.doi | 10.1109/ECTC51906.2022.00009 | |
dc.identifier.eisbn | 978-1-6654-7943-1 | |
dc.source.numberofpages | 5 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 7 | |
dc.source.endpage | 11 | |
dc.source.conference | 72nd IEEE Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | MAY 31-JUN 01, 2022 | |
dc.source.conferencelocation | San Diego | |
dc.source.journal | na | |
imec.availability | Published - imec | |