Browsing by author "Velenis, Dimitrios"

110GHz Through-Silicon Via's Integrated in Silicon Photonics Interposers for Next-Generation Optical Modules

Miyaguchi, Kenichi; Ban, Yoojin; Pantano, Nicolas; Sun, Xiao; Absil, Philippe; Bogaerts, Lieve; Verheyen, Peter; Velenis, Dimitrios; Pantouvaki, Marianna; Van Campenhout, Joris (2021)

32x100 GHz WDM filter based on ultra-compact silicon rings with a high thermal tuning efficiency of 5.85 mW/Ï

Deng, Qingzhong; El-Saeed, Ahmed H.; Elshazly, Alaa; Lepage, Guy; Marchese, Chiara; Kobbi, Hakim; Magdziak, Rafal; De Coster, Jeroen; Singh, Neha; Ersek Filipcic, Marko; Croes, Kristof; Velenis, Dimitrios; Chakrabarti, Maumita; De Heyn, Peter; Verheyen, Peter; Absil, Philippe; Ferraro, Filippo; Ban, Yoojin; Van Campenhout, Joris (2024)

3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network

Sun, Xiao; Lin, Hesheng; Velenis, Dimitrios; Slabbekoorn, John; Talmelli, Giacomo; Bex, Pieter; Sterken, Tom; Lauwereins, Rudy; Adelmann, Christoph; Miller, Andy; Van der Plas, Geert; Beyne, Eric (2020)

3D IC interconnects: microbump yield electrical characterization and TSV modeling

Vakoula, Panagiota; Tyrovouzi, Anna-Maria; Velenis, Dimitrios; Stucchi, Michele; Croes, Kristof (2014)

3D Integration: Circuit design, test and reliability challenges

Minas, Nikolaos; De Wolf, Ingrid; Marinissen, Erik Jan; Stucchi, Michele; Oprins, Herman; Mercha, Abdelkarim; Van der Plas, Geert; Velenis, Dimitrios; Marchal, Pol (2010)

3D stacking using ultra thin dies

La Manna, Antonio; Velenis, Dimitrios; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Zhang, Wenqi; Beyne, Eric (2012)

84%-Efficiency Fully Integrated Voltage Regulator for Computing Systems Enabled by 2.5-D High-Density MIM Capacitor

Lin, Hesheng; Velenis, Dimitrios; Nolmans, Philip; Sun, Xiao; Catthoor, Francky; Lauwereins, Rudy; Van der Plas, Geert; Beyne, Eric (2022)

91.5%-Efficiency fully integrated voltage regulator with 86fF/μm2-high-density 2.5 MIM capacitor

Lin, Hesheng; Velenis, Dimitrios; Nolmans, Philip; Sun, Xiao; Catthoor, Francky; Lauwereins, Rudy; Van der Plas, Geert; Beyne, Eric (2021)

A high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiency

Pantano, Nicolas; Van der Plas, Geert; Bex, Pieter; Nolmans, Philip; Velenis, Dimitrios; Verhelst, Marian; Beyne, Eric (2019)

Active-lite interposer for 2.5 & 3D integration

Hellings, Geert; Scholz, Mirko; Detalle, Mikael; Velenis, Dimitrios; de Potter de ten Broeck, Muriel; Roda Neve, Cesar; Li, Yunlong; Van Huylenbroeck, Stefaan; Chen, Shih-Hung; Marinissen, Erik Jan; La Manna, Antonio; Van der Plas, Geert; Linten, Dimitri; Beyne, Eric; Thean, Aaron (2015)

An IC-centric biocompatible chip encapsulation fabrication process

Op de Beeck, Maaike; La Manna, Antonio; Buisson, Thibault; Dy, Eric; Velenis, Dimitrios; Axisa, Fabrice; Soussan, Philippe; Van Hoof, Chris (2010)

Backside power delivery with a direct 14:1/19:1 high-ratio point-of-load power converter for servers and datacenters

Lin, Hesheng; Hiblot, Gaspard; Sun, Xiao; Talmelli, Giacomo; Velenis, Dimitrios; Bex, Pieter; Adelmann, Christoph; Lauwereins, Rudy; Catthoor, Francky; Van der Plas, Geert; Beyne, Eric (2021)

Capacitance measurements of 2-dimensional and 3-dimensional IC interconnect structures by quasi-static C-V technique

Stucchi, Michele; Velenis, Dimitrios; Katti, Guruprasad (2012)

Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices

La Manna, Antonio; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Velenis, Dimitrios; Zhang, Wenqi; Beyne, Eric (2012-06)

Characterization of Impact of Vertical Stress on FinFETs

Furuhashi, Takahisa; Haneda, Masaki; Sasaki, Toru; Kagawa, Yoshihisa; Ooka, Yutaka; Hirano, Tomoyuki; Ohno, Keiichi; Iwamoto, Hayato; Saito, Masaki; Liu, Yefan; Hiblot, Gaspard; Vanstreels, Kris; Gonzalez, Mario; Velenis, Dimitrios; Beyer, Gerald; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric (2019)