Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices

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Authors
La Manna, Antonio; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Velenis, Dimitrios; Zhang, Wenqi; Beyne, Eric
Conference
62nd Electronic Components and Technology Conference - ECTC
Title
Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices
Publication type
Proceedings paper
Embargo date
9999-12-31
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