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Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices

Date

2012-06
Proceedings Paper
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dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBuisson, Thibault
dc.contributor.authorDetalle, Mikael
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorZhang, Wenqi
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-20T12:28:13Z
dc.date.available2021-10-20T12:28:13Z
dc.date.embargo9999-12-31
dc.date.issued2012-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20972
dc.source.beginpage532
dc.source.conference62nd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate29/05/2012
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage536
dc.title

Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices

dc.typeProceedings paper
dspace.entity.typePublication
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