110GHz Through-Silicon Via's Integrated in Silicon Photonics Interposers for Next-Generation Optical Modules

Abstract

We report Through-Si Via's (TSV) with RF bandwidth beyond 110GHz integrated in a Silicon Photonics interposer, targeting next-generation optical modules operating at 100Gbaud data rates. Showcasing low RF loss, high-quality data transmission is demonstrated at 112Gb/s NRZ data rate for test structures including two TSVs.