Browsing by author "Bogaerts, Lieve"
Now showing items 1-20 of 26
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110GHz Through-Silicon Via's Integrated in Silicon Photonics Interposers for Next-Generation Optical Modules
Miyaguchi, Kenichi; Ban, Yoojin; Pantano, Nicolas; Sun, Xiao; Absil, Philippe; Bogaerts, Lieve; Verheyen, Peter; Velenis, Dimitrios; Pantouvaki, Marianna; Van Campenhout, Joris (2021) -
A MEMS 0-level packaging technology based on CuSn/Cu chip capping bonding
Bogaerts, Lieve; Phommahaxay, Alain; Rottenberg, Xavier; Naito, Yasyuki; De Coster, Jeroen; Varela Pedreira, Olalla; Van Hoovels, Nele; Cherman, Vladimir; Helin, Philippe; Onishi, K.; Tilmans, Harrie (2011) -
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module
Van Huylenbroeck, Stefaan; Li, Yunlong; Stucchi, Michele; Bogaerts, Lieve; De Vos, Joeri; Beyer, Gerald; Beyne, Eric; Brouri, Mohand; Nalla, Praveen; Gopinath, Sanjay; Thorum, Matthew; Richardson, Joe; Yu, Jengyi (2016) -
Design of RF feedthroughs in Zero-level packaging for RF MEMS implementing TSVs
El Gannudi, Hamza; Cherman, Vladimir; Farinelli, Paola; Pham, Nga; Bogaerts, Lieve; Tilmans, Harrie; Sorrentino, Roberto (2011) -
Grinding and mixed silicon copper CMP of stacked patterned wafers for 3D integration
De Munck, Koen; Vaes, Jan; Bogaerts, Lieve; De Moor, Piet; Van Hoof, Chris; Swinnen, Bart (2007) -
High bandwidth density optically interconnected terabit/s boards
Romagnoli, M.; De Angelis, G.; Tallone, L.; Sorianello, V.; Tirelli, S.; Snyder, Brad; De Heyn, Peter; Ban, Yoojin; Bogaerts, Lieve; Verheyen, Peter; Miller, Andy; Van Campenhout, Joris; Pantouvaki, Marianna; Absil, Philippe; Bauwelinck, Johan; Yin, Xin; Van Thourhout, Dries; Juvert Sandez, Joan; Osellame, R.; Vazquez, R.M.; Lopes, D.P.; Preve, G.B.; Rodrigo, A.A.S.; Galli, P.; Chiaretti, G.; Testa, F.; Bianchi, A.; Gonzalez, A.B. (2018-02) -
High-speed TSV integration in an active silicon photonics interposer platform
Bogaerts, Lieve; El-Mekki, Zaid; Van Huylenbroeck, Stefaan; Nolmans, Philip; Pantano, Nicolas; Sun, Xiao; Rakowski, Michal; Velenis, Dimitrios; Verheyen, Peter; Balakrishnan, Sadhishkumar; De Heyn, Peter; Ban, Yoojin; Srinivasan, Ashwyn; Lardenois, Sebastien; De Coster, Jeroen; Detalle, Mikael; Absil, Philippe; Miller, Andy; Pantouvaki, Marianna; Van Campenhout, Joris (2018) -
Hybrid 14nm FinFET - Silicon photonics technology for low-power Tb/s/mm2 optical I/O
Rakowski, Michal; Ban, Yoojin; De Heyn, Peter; Pantano, Nicolas; Snyder, Brad; Balakrishnan, Sadhishkumar; Van Huylenbroeck, Stefaan; Bogaerts, Lieve; Demeurisse, Caroline; Inoue, Fumihiro; Rebibis, Kenneth June; Nolmans, Philip; Sun, Xiao; Bex, Pieter; Srinivasan, Ashwyn; De Coster, Jeroen; Lardenois, Sebastien; Miller, Andy; Absil, Philippe; Verheyen, Peter; Velenis, Dimitrios; Pantouvaki, Marianna; Van Campenhout, Joris (2018) -
Integration of etched facet, electrically pumped, C-band fabry-perot lasers on a silicon photonic integrated circuit by transfer printing
Juvert Sandez, Joan; Cassese, Tommaso; Uvin, Sarah; De Groote, Andreas; Snyder, Brad; Bogaerts, Lieve; Jamieson, Geraldine; Van Campenhout, Joris; Roelkens, Gunther; Van Thourhout, Dries (2018-08) -
Key elements for sub-50μm pitch micro bump processes
De Vos, Joeri; Bogaerts, Lieve; Buisson, Thibault; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio; Beyne, Eric (2013) -
Mechanical characterization of micro-bump for aggressive bump scaling
Zhang, Wenqi; Mai, Zhide; Bogaerts, Lieve; Gonzalez, Mario; Vakanas, George; La Manna, Antonio; Beyne, Eric (2012) -
Microbump development on small bump pitch (50μm and lower)
Bogaerts, Lieve; De Vos, Joeri; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio (2012) -
Packaging and assembly challenges for 50G silicon photonics interposers
Snyder, Brad; Mangal, Nivesh; Lepage, Guy; Balakrishnan, Sadhishkumar; Sun, Xiao; Pantano, Nicolas; Rakowski, Michal; Bogaerts, Lieve; De Heyn, Peter; Verheyen, Peter; Miller, Andy; Pantouvaki, Marianna; Absil, Philippe; Van Campenhout, Joris (2018) -
Packaging of 11MPixel CMOS-integrated SiGe micro-mirror arrays
Witvrouw, Ann; Tilmans, Harrie; Bogaerts, Lieve; De Moor, Piet; Bearda, Twan; Halder, Sandip; Haspeslagh, Luc; Schlatmann, Bart; van Bommel, Mark; de Nooijer, Christine; Lauria, John; Vanneer, Roel; van Drieenhuizen, Bert (2009) -
Process development to enable die sorting and 3D IC stacking
La Manna, Antonio; Daily, Robert; Capuz, Giovanni; Rebibis, Kenneth June; Bogaerts, Lieve; Miller, Andy; Beyne, Eric (2012-12) -
Process related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitch
Bogaerts, Lieve; De Vos, Joeri; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio (2012-12) -
Scaling of sol-gel PZT ferroelectric capacitors for low-voltage operation
Wouters, Dirk; Norga, Gerd; Beckers, Françoise; Bogaerts, Lieve; Maes, Herman (1997) -
Small pitch micro-bumping and experimental investigation for under filling 3D stacking
La Manna, Antonio; Rebibis, Kenneth June; De Vos, Joeri; Bogaerts, Lieve; Gerets, Carine; Beyne, Eric (2012-09) -
Small pitch, high aspect ratio via-last TSV module
Van Huylenbroeck, Stefaan; Stucchi, Michele; Li, Yunlong; Slabbekoorn, John; Tutunjyan, Nina; Sardo, Stefano; Jourdan, Nicolas; Bogaerts, Lieve; Beirnaert, Filip; Beyer, Gerald; Beyne, Eric (2016) -
Temporary 0-level MEMS packaging using a heat decomposable sealing ring
Bogaerts, Lieve; Phommahaxay, Alain; Gerets, Carine; Jaenen, Patrick; Van Hoof, Rita; Severi, Simone; De Coster, Jeroen; Soussan, Philippe; Witvrouw, Ann; Beernaert, Roel; Rudra, Sukumar (2011)