Browsing by author "Bogaerts, Lieve"
Now showing items 21-26 of 26
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Temporary protective packaging for optical MEMS
Bogaerts, Lieve; Phommahaxay, Alain; Gerets, Carine; Jaenen, Patrick; Van Hoof, Rita; Severi, Simone; Van De Peer, Myriam; De Coster, Jeroen; La Manna, Antonio; Soussan, Philippe; Witvrouw, Ann (2011) -
The influence of grinding and cleaning on Deep Reactive Ion Etching
Verdonck, Patrick; Van Cauwenberghe, Marc; Phommahaxay, Alain; Jamieson, Geraldine; Bogaerts, Lieve; Cotrin Teixeira, Ricardo; Huyghebaert, Cedric; Tutunjyan, Nina; Bearda, Twan; Boullart, Werner (2009) -
The Minipackage: a flexible wafer-level packaging solution for MEMS
De Moor, Piet; Baert, Kris; Bogaerts, Lieve; Du Bois, Bert; Jamieson, Geraldine; Jourdain, Anne; Van Hoof, Chris (2004) -
Thin MEMS packages obtained by a novel collective cap transfer process
Phommahaxay, Alain; Bogaerts, Lieve; Naito, Yasuyuki; Van Cauwenberghe, Marc; Tutunjyan, Nina; Onishi, Keiji; Tilmans, Harrie (2011) -
TSV-assisted hybrid FinFET CMOS - Silicon photonics technology for high density optical I/O
Guermandi, Davide; Bogaerts, Lieve; Rakowski, Michal; Ban, Yoojin; De Heyn, Peter; Pantano, Nicolas; Bex, Pieter; De Coster, Jeroen; He, Junwen; Phommahaxay, Alain; Balakrishnan, Sadhishkumar; Demeurisse, Caroline; Bertheau, Julien; Rebibis, Kenneth June; Nolmans, Philip; Sun, Xiao; Srinivasan, Ashwyn; Van Huylenbroeck, Stefaan; Lardenois, Sebastien; Miller, Andy; Absil, Philippe; Verheyen, Peter; Velenis, Dimitrios; Pantouvaki, Marianna; Van Campenhout, Joris (2019) -
Wafer thinning and back side processing to enable 3D stacking
Detalle, Mikael; Bogaerts, Lieve; La Manna, Antonio; Buisson, Thibault; Velenis, Dimitrios; Beyne, Eric (2012)