Wafer thinning and back side processing to enable 3D stacking

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Authors
Detalle, Mikael; Bogaerts, Lieve; La Manna, Antonio; Buisson, Thibault; Velenis, Dimitrios; Beyne, Eric
Conference
4th Electronics System Integration Technologies Conference - ESTC
Title
Wafer thinning and back side processing to enable 3D stacking
Publication type
Proceedings paper
Embargo date
9999-12-31
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