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Process related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitch
Publication:
Process related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitch
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Date
2012-12
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Bogaerts, Lieve
;
De Vos, Joeri
;
Gerets, Carine
;
Jamieson, Geraldine
;
Vandersmissen, Kevin
;
La Manna, Antonio
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1901
since deposited on 2021-10-20
Acq. date: 2026-01-11
Citations
Metrics
Views
1901
since deposited on 2021-10-20
Acq. date: 2026-01-11
Citations