Publication:
Process related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitch
Date
| dc.contributor.author | Bogaerts, Lieve | |
| dc.contributor.author | De Vos, Joeri | |
| dc.contributor.author | Gerets, Carine | |
| dc.contributor.author | Jamieson, Geraldine | |
| dc.contributor.author | Vandersmissen, Kevin | |
| dc.contributor.author | La Manna, Antonio | |
| dc.contributor.imecauthor | Bogaerts, Lieve | |
| dc.contributor.imecauthor | De Vos, Joeri | |
| dc.contributor.imecauthor | Gerets, Carine | |
| dc.contributor.imecauthor | Jamieson, Geraldine | |
| dc.contributor.imecauthor | Vandersmissen, Kevin | |
| dc.contributor.imecauthor | La Manna, Antonio | |
| dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
| dc.contributor.orcidimec | Jamieson, Geraldine::0000-0002-6750-097X | |
| dc.date.accessioned | 2021-10-20T10:07:01Z | |
| dc.date.available | 2021-10-20T10:07:01Z | |
| dc.date.issued | 2012-12 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/20372 | |
| dc.source.conference | 14th Electronics Packaging Technology Conference - EPTC | |
| dc.source.conferencedate | 5/12/2012 | |
| dc.source.conferencelocation | Singapore Singapore | |
| dc.title | Process related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitch | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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