Grinding and mixed silicon copper CMP of stacked patterned wafers for 3D integration

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Authors
De Munck, Koen; Vaes, Jan; Bogaerts, Lieve; De Moor, Piet; Van Hoof, Chris; Swinnen, Bart
Conference
Enabling Technologies for 3-D Integration
Title
Grinding and mixed silicon copper CMP of stacked patterned wafers for 3D integration
Publication type
Proceedings paper
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