Small pitch, high aspect ratio via-last TSV module

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Authors
Van Huylenbroeck, Stefaan; Stucchi, Michele; Li, Yunlong; Slabbekoorn, John; Tutunjyan, Nina; Sardo, Stefano; Jourdan, Nicolas; Bogaerts, Lieve; Beirnaert, Filip; Beyer, Gerald; Beyne, Eric
Conference
IEEE 66th Electronic Components and Technology Conference - ECTC
Title
Small pitch, high aspect ratio via-last TSV module
Publication type
Proceedings paper
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