Publication:

Small pitch, high aspect ratio via-last TSV module

Date

2016
Proceedings Paper
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dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorStucchi, Michele
dc.contributor.authorLi, Yunlong
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorSardo, Stefano
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorBeirnaert, Filip
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorSardo, Stefano
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorBeirnaert, Filip
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecSardo, Stefano::0000-0002-9302-8007
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T16:09:45Z
dc.date.available2021-10-23T16:09:45Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27469
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7545409/?arnumber=7545409
dc.source.beginpage43
dc.source.conferenceIEEE 66th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage49
dc.title

Small pitch, high aspect ratio via-last TSV module

dc.typeProceedings paper
dspace.entity.typePublication
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