Publication:

Packaging and assembly challenges for 50G silicon photonics interposers

Date

2018

Proceedings Paper

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37140.pdf 1.07 MB

Author(s)

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Balakrishnan, Sadhishkumar

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Pantano, Nicolas

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Rakowski, Michal

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Bogaerts, Lieve

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Verheyen, Peter

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Pantouvaki, Marianna

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Absil, Philippe

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Van Campenhout, Joris

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Acq. date: 2026-10-09