Packaging and assembly challenges for 50G silicon photonics interposers

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Authors
Snyder, Brad; Mangal, Nivesh; Lepage, Guy; Balakrishnan, Sadhishkumar; Sun, Xiao; Pantano, Nicolas; Rakowski, Michal; Bogaerts, Lieve; De Heyn, Peter; Verheyen, Peter; Miller, Andy; Pantouvaki, Marianna; Absil, Philippe; Van Campenhout, Joris
Conference
Optical Fiber Communication Conference and Exhibition - OFC
Title
Packaging and assembly challenges for 50G silicon photonics interposers
Publication type
Proceedings paper
Embargo date
9999-12-31
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