Publication:

Packaging and assembly challenges for 50G silicon photonics interposers

Date

2018
Proceedings Paper
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Author(s)

Snyder, Brad
;
Mangal, Nivesh  
;
Lepage, Guy  
;
Balakrishnan, Sadhishkumar  
;
Sun, Xiao  
;
Pantano, Nicolas  
;
Rakowski, Michal  
;
Bogaerts, Lieve  
;
De Heyn, Peter  
;
Verheyen, Peter  
;
Miller, Andy  
;
Pantouvaki, Marianna  
;
Absil, Philippe  
;
Van Campenhout, Joris  

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1996 since deposited on 2021-10-26
Acq. date: 2025-12-11

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1996 since deposited on 2021-10-26
Acq. date: 2025-12-11

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