Publication:

Packaging and assembly challenges for 50G silicon photonics interposers

Date

2018
Proceedings Paper
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dc.contributor.authorSnyder, Brad
dc.contributor.authorMangal, Nivesh
dc.contributor.authorLepage, Guy
dc.contributor.authorBalakrishnan, Sadhishkumar
dc.contributor.authorSun, Xiao
dc.contributor.authorPantano, Nicolas
dc.contributor.authorRakowski, Michal
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorDe Heyn, Peter
dc.contributor.authorVerheyen, Peter
dc.contributor.authorMiller, Andy
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorAbsil, Philippe
dc.contributor.authorVan Campenhout, Joris
dc.contributor.imecauthorMangal, Nivesh
dc.contributor.imecauthorLepage, Guy
dc.contributor.imecauthorBalakrishnan, Sadhishkumar
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorRakowski, Michal
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorDe Heyn, Peter
dc.contributor.imecauthorVerheyen, Peter
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorAbsil, Philippe
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.orcidimecDe Heyn, Peter::0000-0003-3523-7377
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.date.accessioned2021-10-26T04:19:26Z
dc.date.available2021-10-26T04:19:26Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31822
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8385876
dc.source.beginpageTu2A.3
dc.source.conferenceOptical Fiber Communication Conference and Exhibition - OFC
dc.source.conferencedate11/03/2018
dc.source.conferencelocationSan Diego, CA USA
dc.title

Packaging and assembly challenges for 50G silicon photonics interposers

dc.typeProceedings paper
dspace.entity.typePublication
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