Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module

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Authors
Van Huylenbroeck, Stefaan; Li, Yunlong; Stucchi, Michele; Bogaerts, Lieve; De Vos, Joeri; Beyer, Gerald; Beyne, Eric; Brouri, Mohand; Nalla, Praveen; Gopinath, Sanjay; Thorum, Matthew; Richardson, Joe; Yu, Jengyi
Conference
IEEE International Conference on 3D System Integration - 3DIC
Title
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module
Publication type
Proceedings paper
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