Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Conference contributions
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module
Publication:
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module
Date
2016
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Van Huylenbroeck, Stefaan
;
Li, Yunlong
;
Stucchi, Michele
;
Bogaerts, Lieve
;
De Vos, Joeri
;
Beyer, Gerald
;
Beyne, Eric
;
Brouri, Mohand
;
Nalla, Praveen
;
Gopinath, Sanjay
;
Thorum, Matthew
;
Richardson, Joe
;
Yu, Jengyi
Journal
Abstract
Description
Metrics
Views
1946
since deposited on 2021-10-23
Acq. date: 2025-10-22
Citations
Metrics
Views
1946
since deposited on 2021-10-23
Acq. date: 2025-10-22
Citations