Publication:

Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module

Date

2016
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorLi, Yunlong
dc.contributor.authorStucchi, Michele
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorBrouri, Mohand
dc.contributor.authorNalla, Praveen
dc.contributor.authorGopinath, Sanjay
dc.contributor.authorThorum, Matthew
dc.contributor.authorRichardson, Joe
dc.contributor.authorYu, Jengyi
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T16:09:11Z
dc.date.available2021-10-23T16:09:11Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27468
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7970001/
dc.source.beginpage1
dc.source.conferenceIEEE International Conference on 3D System Integration - 3DIC
dc.source.conferencedate8/11/2016
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage4
dc.title

Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions