Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Conference contributions
Design of RF feedthroughs in Zero-level packaging for RF MEMS implementing TSVs
Publication:
Design of RF feedthroughs in Zero-level packaging for RF MEMS implementing TSVs
Date
2011
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
El Gannudi, Hamza
;
Cherman, Vladimir
;
Farinelli, Paola
;
Pham, Nga
;
Bogaerts, Lieve
;
Tilmans, Harrie
;
Sorrentino, Roberto
Journal
Abstract
Description
Metrics
Views
1859
since deposited on 2021-10-19
Acq. date: 2025-10-27
Citations
Metrics
Views
1859
since deposited on 2021-10-19
Acq. date: 2025-10-27
Citations