Mechanical characterization of micro-bump for aggressive bump scaling

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Authors
Zhang, Wenqi; Mai, Zhide; Bogaerts, Lieve; Gonzalez, Mario; Vakanas, George; La Manna, Antonio; Beyne, Eric
Conference
4th Electronics System Integration Technologies Conference - ESTC
Title
Mechanical characterization of micro-bump for aggressive bump scaling
Publication type
Proceedings paper
Embargo date
9999-12-31
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