Browsing by author "Pantano, Nicolas"

110GHz Through-Silicon Via's Integrated in Silicon Photonics Interposers for Next-Generation Optical Modules

Miyaguchi, Kenichi; Ban, Yoojin; Pantano, Nicolas; Sun, Xiao; Absil, Philippe; Bogaerts, Lieve; Verheyen, Peter; Velenis, Dimitrios; Pantouvaki, Marianna; Van Campenhout, Joris (2021)

A high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiency

Pantano, Nicolas; Van der Plas, Geert; Bex, Pieter; Nolmans, Philip; Velenis, Dimitrios; Verhelst, Marian; Beyne, Eric (2019)

Analysis and Application of a Surface Admittance Operator for Combined Magnetic and Dielectric Contrast in Emerging Interconnect Topologies

Bosman, Dries; Huynen, Martijn; De Zutter, Daniel; Sun, Xiao; Pantano, Nicolas; Van Der Plas, Geert; Beyne, Eric; Ginste, Dries Vande (2023)

Broadband Characterization of Polymers under Reliability Stresses and Impact of Capping Layer

Pantano, Nicolas; Chery, Emmanuel; Op de Beeck, Maaike; Slabbekoorn, John; Beyne, Eric (2022)

Broadband permittivity characterization of polymers up to 110GHz using co-planar waveguides

Pantano, Nicolas; Slabbekoorn, John; Duval, Fabrice; Beyne, Eric (2021)

Efficient Characterization of Interconnects With Arbitrary Polygonal Cross Sections Using Fokas-Derived Dirichlet-to-Neumann Operators

Bosman, Dries; Huynen, Martijn; De Zutter, Daniel; Sun, Xiao; Pantano, Nicolas; van der Plas, Geert; Beyne, Eric; Ginste, Dries Vande; Vande Ginste, Dries (2023)

ESD mitigation for 3D IC hybrid bonding

Lin, Shih-Hsiang; Simicic, Marko; Pantano, Nicolas; Chen, Shih-Hung; Roussel, Philippe; Van der Plas, Geert; Beyne, Eric; Wambacq, Piet (2023)

High-speed TSV integration in an active silicon photonics interposer platform

Bogaerts, Lieve; El-Mekki, Zaid; Van Huylenbroeck, Stefaan; Nolmans, Philip; Pantano, Nicolas; Sun, Xiao; Rakowski, Michal; Velenis, Dimitrios; Verheyen, Peter; Balakrishnan, Sadhishkumar; De Heyn, Peter; Ban, Yoojin; Srinivasan, Ashwyn; Lardenois, Sebastien; De Coster, Jeroen; Detalle, Mikael; Absil, Philippe; Miller, Andy; Pantouvaki, Marianna; Van Campenhout, Joris (2018)

Highly Optimized 0-band Si Ring Modulators for Low-Power Hybrid CMOS-SiPho Transceivers

Ban, Yoojin; Kim, Minkyu; De Heyn, Peter; Guermandi, Davide; Ferraro, Filippo; Rajasekaran, Natarajan; Verheyen, Peter; Bex, Pieter; He, Junwen; Kobbi, Hakim; De Coster, Jeroen; Magdziak, Rafal; Bode, Dieter; Lardenois, Sebastien; Pantano, Nicolas; Velenis, Dimitrios; Van Campenhout, Joris (2023)

Hybrid 14nm FinFET - Silicon photonics technology for low-power Tb/s/mm2 optical I/O

Rakowski, Michal; Ban, Yoojin; De Heyn, Peter; Pantano, Nicolas; Snyder, Brad; Balakrishnan, Sadhishkumar; Van Huylenbroeck, Stefaan; Bogaerts, Lieve; Demeurisse, Caroline; Inoue, Fumihiro; Rebibis, Kenneth June; Nolmans, Philip; Sun, Xiao; Bex, Pieter; Srinivasan, Ashwyn; De Coster, Jeroen; Lardenois, Sebastien; Miller, Andy; Absil, Philippe; Verheyen, Peter; Velenis, Dimitrios; Pantouvaki, Marianna; Van Campenhout, Joris (2018)

Inductive links for 3D stacked chip-to-chip communication

Sun, Xiao; Pantano, Nicolas; Kim, Soon-Wook; Van der Plas, Geert; Beyne, Eric (2019)

Investigation of chip-to-chip interconnections for memory-logic communication on 3D interposer technology

Roda Neve, Cesar; Ryckaert, Julien; Van der Plas, Geert; Detalle, Mikael; Beyne, Eric; Pantano, Nicolas; Verhelst, Marian (2014)

Modeling and optimization of hybrid FinFET-silicon photonic interconnects

Pantano, Nicolas; Rakowski, Michal; Guermandi, Davide; Verhelst, Marian; Van Campenhout, Joris (2020)

Packaging and assembly challenges for 50G silicon photonics interposers

Snyder, Brad; Mangal, Nivesh; Lepage, Guy; Balakrishnan, Sadhishkumar; Sun, Xiao; Pantano, Nicolas; Rakowski, Michal; Bogaerts, Lieve; De Heyn, Peter; Verheyen, Peter; Miller, Andy; Pantouvaki, Marianna; Absil, Philippe; Van Campenhout, Joris (2018)

Tbps/mm bandwidth for chip-to-chip communication using fine pitch damascene RDL

Pantano, Nicolas; Slabbekoorn, John; Van der Plas, Geert; Beyne, Eric (2020)

Technology optimization for high bandwidth density applications on 3D interposer

Pantano, Nicolas; Roda Neve, Cesar; Van der Plas, Geert; Detalle, Mikael; Verhelst, Marian; Heyns, Marc; Beyne, Eric (2016)

TSV-assisted hybrid FinFET CMOS - Silicon photonics technology for high density optical I/O

Guermandi, Davide; Bogaerts, Lieve; Rakowski, Michal; Ban, Yoojin; De Heyn, Peter; Pantano, Nicolas; Bex, Pieter; De Coster, Jeroen; He, Junwen; Phommahaxay, Alain; Balakrishnan, Sadhishkumar; Demeurisse, Caroline; Bertheau, Julien; Rebibis, Kenneth June; Nolmans, Philip; Sun, Xiao; Srinivasan, Ashwyn; Van Huylenbroeck, Stefaan; Lardenois, Sebastien; Miller, Andy; Absil, Philippe; Verheyen, Peter; Velenis, Dimitrios; Pantouvaki, Marianna; Van Campenhout, Joris (2019)

Ultra-Fine Pitch RDL (UFPRDL) using Polymer Dual Damascene processing

Pinho, Nelson; Chery, Emmanuel; Pantano, Nicolas; Slabbekoorn, John; Miller, Andy; Beyne, Eric (2023)