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Investigation of chip-to-chip interconnections for memory-logic communication on 3D interposer technology
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Authors
Roda Neve, Cesar
;
Ryckaert, Julien
;
Van der Plas, Geert
;
Detalle, Mikael
;
Beyne, Eric
;
Pantano, Nicolas
;
Verhelst, Marian
Conference
IEEE 18th Workshop on Signal and Power Integrity - SPI
Title
Investigation of chip-to-chip interconnections for memory-logic communication on 3D interposer technology
Publication type
Proceedings paper
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