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Investigation of chip-to-chip interconnections for memory-logic communication on 3D interposer technology
Publication:
Investigation of chip-to-chip interconnections for memory-logic communication on 3D interposer technology
Date
2014
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Roda Neve, Cesar
;
Ryckaert, Julien
;
Van der Plas, Geert
;
Detalle, Mikael
;
Beyne, Eric
;
Pantano, Nicolas
;
Verhelst, Marian
Journal
Abstract
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1946
since deposited on 2021-10-22
421
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations
Metrics
Views
1946
since deposited on 2021-10-22
421
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations