3D IC interconnects: microbump yield electrical characterization and TSV modeling

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Authors
Vakoula, Panagiota; Tyrovouzi, Anna-Maria; Velenis, Dimitrios; Stucchi, Michele; Croes, Kristof
Conference
Electrical and Computer Engineering Greek Student Conference
Title
3D IC interconnects: microbump yield electrical characterization and TSV modeling
Publication type
Proceedings paper
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