Authors

Beyne, Eric; Van Hoof, Rita; Webers, Tomas; Brebels, Steven; Rossi, S.; Lechleiter, F.; Di Ianni, M.; Ostmann, A.

Issue

3

Journal

Microelectronics International

Volume

18

Title

High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)

Publication type

Journal article