Publication:
High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Van Hoof, Rita | |
| dc.contributor.author | Webers, Tomas | |
| dc.contributor.author | Brebels, Steven | |
| dc.contributor.author | Rossi, S. | |
| dc.contributor.author | Lechleiter, F. | |
| dc.contributor.author | Di Ianni, M. | |
| dc.contributor.author | Ostmann, A. | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Van Hoof, Rita | |
| dc.contributor.imecauthor | Webers, Tomas | |
| dc.contributor.imecauthor | Brebels, Steven | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Brebels, Steven::0000-0002-1568-0286 | |
| dc.date.accessioned | 2021-10-14T16:37:35Z | |
| dc.date.available | 2021-10-14T16:37:35Z | |
| dc.date.issued | 2001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5066 | |
| dc.source.beginpage | 36 | |
| dc.source.endpage | 42 | |
| dc.source.issue | 3 | |
| dc.source.journal | Microelectronics International | |
| dc.source.volume | 18 | |
| dc.title | High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D) | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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