Authors

Vandevelde, Bart; Labie, Riet; Cherman, Vladimir; Webers, Tomas; Winters, Christophe; Beyne, Eric; Dosseul, Franck

Conference

12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE

Title

Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies

Publication type

Proceedings paper

Embargo date

9999-12-31