Publication:

Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies

Date

2011
Proceedings Paper
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dc.contributor.authorVandevelde, Bart
dc.contributor.authorLabie, Riet
dc.contributor.authorCherman, Vladimir
dc.contributor.authorWebers, Tomas
dc.contributor.authorWinters, Christophe
dc.contributor.authorBeyne, Eric
dc.contributor.authorDosseul, Franck
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorWinters, Christophe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-19T20:43:01Z
dc.date.available2021-10-19T20:43:01Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20020
dc.source.conference12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE
dc.source.conferencedate17/04/2011
dc.source.conferencelocationLinz Austria
dc.title

Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies

dc.typeProceedings paper
dspace.entity.typePublication
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