Electromigration failure mechanisms for different flip chip configurations

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Authors
Labie, Riet; Webers, Tomas; Winters, Christophe; Cherman, Vladimir; Croes, Kristof; Vandevelde, Bart; Dosseul, Franck
Conference
IEEE International Reliability Physics Symposium - IRPS
Title
Electromigration failure mechanisms for different flip chip configurations
Publication type
Proceedings paper
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