Authors

Soussan, Philippe; Sabuncuoglu Tezcan, Deniz; Iker, Francois; Ruythooren, Wouter; Swinnen, Bart; Majeed, Bivragh; Beyne, Eric

Conference

Materials and Technologies for 3-D Integration

Title

3D Wafer level packaging: processes and materials for through silicon-vias and thin die embedding

Publication type

Proceedings paper