Publication:
3D Wafer level packaging: processes and materials for through silicon-vias and thin die embedding
Date
| dc.contributor.author | Soussan, Philippe | |
| dc.contributor.author | Sabuncuoglu Tezcan, Deniz | |
| dc.contributor.author | Iker, Francois | |
| dc.contributor.author | Ruythooren, Wouter | |
| dc.contributor.author | Swinnen, Bart | |
| dc.contributor.author | Majeed, Bivragh | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Soussan, Philippe | |
| dc.contributor.imecauthor | Sabuncuoglu Tezcan, Deniz | |
| dc.contributor.imecauthor | Ruythooren, Wouter | |
| dc.contributor.imecauthor | Swinnen, Bart | |
| dc.contributor.imecauthor | Majeed, Bivragh | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
| dc.contributor.orcidimec | Sabuncuoglu Tezcan, Deniz::0000-0002-9237-7862 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-18T03:19:35Z | |
| dc.date.available | 2021-10-18T03:19:35Z | |
| dc.date.issued | 2009 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16262 | |
| dc.source.beginpage | 1112-E01-05 | |
| dc.source.conference | Materials and Technologies for 3-D Integration | |
| dc.source.conferencedate | 1/12/2008 | |
| dc.source.conferencelocation | Boston, MA USA | |
| dc.title | 3D Wafer level packaging: processes and materials for through silicon-vias and thin die embedding | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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