Browsing by author "Jourdain, Anne"

0-Level packaging techniques for flip-chip mounted MMICs

De Raedt, Walter; Brebels, Steven; Monfraix, P.; Carchon, Geert; Jourdain, Anne; Tilmans, Harrie (2001)

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

Jourdain, Anne; Buisson, Thibault; Phommahaxay, Alain; Privett, Marc; Wallace, Daniel; Sood, Sumant; Bisson, Peter; Beyne, Eric; Travaly, Youssef; Swinnen, Bart (2010-11)

3D backside integration of FinFETs: Is there an impact on LF noise?

Simoen, Eddy; Jourdain, Anne; Claeys, Cor; Veloso, Anabela (2023)

3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps

Guo, Wei; Van der Plas, Geert; Ivankovic, Andrej; Eneman, Geert; Cherman, Vladimir; De Wachter, Bart; Mercha, Abdelkarim; Gonzalez, Mario; Civale, Yann; Redolfi, Augusto; Buisson, Thibault; Jourdain, Anne; Vandevelde, Bart; Rebibis, Kenneth June; De Wolf, Ingrid; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Swinnen, Bart (2012)

3D integration challenges for fine pitch back side micro-bumping on ZoneBOND™ wafers

Buisson, Thibault; De Preter, Inge; Suhard, Samuel; Vandersmissen, Kevin; Jaenen, Patrick; Witters, Thomas; Jamieson, Geraldine; Jourdain, Anne; Van Huylenbroeck, Stefaan; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012)

3D stacked IC demonstration using a through silicon via first approach

Van Olmen, Jan; Mercha, Abdelkarim; Katti, Guruprasad; Huyghebaert, Cedric; Van Aelst, Joke; Seppala, Emma; Zhao, Chao; Armini, Silvia; Vaes, Jan; Cotrin Teixeira, Ricardo; Van Cauwenberghe, Marc; Verdonck, Patrick; Verhemeldonck, Koen; Jourdain, Anne; Ruythooren, Wouter; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Chiarella, Thomas; Parvais, Bertrand; Debusschere, Ingrid; Hoffmann, Thomas Y.; De Wachter, Bart; Dehaene, Wim; Stucchi, Michele; Rakowski, Michal; Soussan, Philippe; Cartuyvels, Rudi; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2008)

3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)

Van Olmen, Jan; Coenen, Jens; Dehaene, Wim; De Meyer, Kristin; Huyghebaert, Cedric; Jourdain, Anne; Katti, Guruprasad; Mercha, Abdelkarim; Rakowski, Michal; Stucchi, Michele; Travaly, Youssef; Beyne, Eric; Swinnen, Bart (2009)

3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding

Katti, Guruprasad; Mercha, Abdelkarim; Van Olmen, Jan; Huyghebaert, Cedric; Jourdain, Anne; Stucchi, Michele; Rakowski, Michal; Debusschere, Ingrid; Soussan, Philippe; Dehaene, Wim; De Meyer, Kristin; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2009)

3D stacking using bump-less process for sub 10μm pitches

Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016)

3D stacking using Cu-Cu direct bonding

Hu, Yu-Hsiang; Liu, C.S.; Lii, M.J.; Rebibis, Kenneth June; Jourdain, Anne; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Yu, (2012-02)

A 60GHz silicon micromachined cavity resonator with integrated tuning MEMS array

Dancila, Dragos; Ekkels, Phillip; Simon, Pascal; Jourdain, Anne; Phommahaxay, Alain; Rottenberg, Xavier; Huynen, Isabelle; Ocket, Ilja; Nauwelaers, Bart; Puers, Bob; De Raedt, Walter; Tilmans, Harrie (2009)

A method to evaluate internal cavity pressure of sealed MEMS devices

De Coster, Jeroen; Jourdain, Anne; Puers, Bob; Tilmans, Harrie (2005)

Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer

Phommahaxay, Alain; Guerrero, Alice; Jourdain, Anne; Potoms, Goedele; Verbinnen, Greet; Bai, Dongshun; Yess, Kim; Arnold, Kim; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2017)

Anomalous C-V inversion in TSV's: The problem and its cure

Stucchi, Michele; De Vos, Joeri; Jourdain, Anne; Li, Yunlong; Van der Plas, Geert; Croes, Kristof; Beyne, Eric (2018)

Assessment of the feasibility of 'multiple chips-to-wafer' thermo-compression bonding using FEM

Okoro, Chukwudi; Jourdain, Anne; Vandevelde, Bart; Swinnen, Bart; Vandepitte, Dirk (2008)

Backside power delivery as a scaling knob for future systems

Chava, Bharani; Shaik, Khaja Ahmad; Jourdain, Anne; Guissi, Sofiane; Weckx, Pieter; Ryckaert, Julien; Van der Plas, Geert; Spessot, Alessio; Beyne, Eric; Mocuta, Anda (2019)

BCB collective bonding for 3D stacking

Jourdain, Anne; De Moor, Piet; Pargfrieder, Stefan; Baert, Kris; Swinnen, Bart; Beyne, Eric (2007-12)

Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration

Jourdain, Anne; Stucchi, Michele; Van Der Plas, Geert; Beyer, Gerald; Beyne, Eric (2022)

Characterization of (near) hermetic zero-level packages for MEMS

De Moor, Piet; Baert, Kris; De Wolf, Ingrid; Jourdain, Anne; Tilmans, Harrie; Witvrouw, Ann; Van Hoof, Chris (2005)

Characterization of extreme Si thinning proces for wafer-to-wafer stacking

Inoue, Fumihiro; Jourdain, Anne; De Vos, Joeri; Peng, Lan; Liebens, Maarten; Armini, Silvia; Uedono, Akira; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2016)