Browsing by author "Jourdain, Anne"
Now showing items 21-40 of 135
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Characterization of optical end-point detection for via reveal processing
Rassoul, Nouredine; Jourdain, Anne; Tutunjyan, Nina; De Vos, Joeri; Sardo, Stefano; Piumi, Daniele; Miller, Andy; Beyne, Eric; Walsby, Edward; Ashraf, Huma; Thomas, Dave (2018) -
Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration
Wostyn, Kurt; Zhao, Ming; Cui, Hushan; Laermans, Patrick; Jourdain, Anne; Verbinnen, Greet; Struyf, Herbert; De Strycker, Steven; Claes, Martine; Travaly, Youssef; Leunissen, Peter (2010) -
Collective hybrid bonding for 3D stacking of ICs
Jourdain, Anne; Swinnen, Bart; Beyne, Eric (2008) -
Comparison between wet and dry silicon via reveal in 3D backside processing
Thomas, Dave; Hopkins, Janet; Ashraf, Huma; Patel, Jash; Ansell, Oliver; Jourdain, Anne; De Vos, Joeri; Miller, Andy; Beyne, Eric (2015) -
Constant voltage electromigration for advanced BEOL copper interconnects
Tang, Baojun; Croes, Kristof; Jourdain, Anne; Boemmels, Juergen; Tokei, Zsolt; De Wolf, Ingrid; Wilcox, Eric; McMullen, Timothy (2015) -
Cost comparison of different TSV implementation options
Velenis, Dimitrios; Van Huylenbroeck, Stefaan; Heylen, Nancy; Vandersmissen, Kevin; Jourdain, Anne; Miller, Andy; Beyne, Eric (2016) -
Cost components for 3D system integration
Velenis, Dimitrios; Detalle, Mikael; Van Huylenbroeck, Stefaan; Jourdain, Anne; Phommahaxay, Alain; Slabbekoorn, John; Wang, Teng; Rebibis, Kenneth June; Marinissen, Erik Jan; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Creep as a reliability problem in MEMS
Modlinski, Robert; Witvrouw, Ann; Ratchev, Petar; Jourdain, Anne; Simons, Veerle; Tilmans, Harrie; den Toonder, Jaap M.J.; Puers, Bob; De Wolf, Ingrid (2004) -
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
Huyghebaert, Cedric; Van Olmen, Jan; Civale, Yann; Phommahaxay, Alain; Jourdain, Anne; Sood, Sumant; Farrens, Shari; Soussan, Philippe (2010) -
Cu-Cu hybrid bonding as option for 3D IC stacking
Hu, Yu-Hsiang; Lii, M.J.; Rebibis, Kenneth June; Jourdain, Anne; La Manna, Antonio; Beyne, Eric; Yu, C.H. (2012) -
Demonstration of a collective hybrid die-to-wafer integration using glass carrier
Suhard, Samuel; Kennes, Koen; Bex, Pieter; Jourdain, Anne; Teugels, Lieve; Walsby, Edward; Bolton, Chris; Patel, Jash; Ashraf, Huma; Barnett, Richard; Fodor, Ferenc; Phommahaxay, Alain; La Tulipe, Douglas Charles; Beyer, Gerald; Beyne, Eric (2021) -
Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal
Phommahaxay, Alain; Nakamura, Atsushi; Jourdain, Anne; Verbinnen, Greet; Kamochi, Yoshitaka; Koyama, Ichiro; Iwai, Yu; Sawano, Mitsuru; Tan, Shiro; Miller, Andy; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2015) -
Demonstration of integrating post-thinning clean and TSV exposure recess etch into a wafer backside thinning process
Zhao, Ming; Hayakawa, Susumu; Nishida, Yoshiteru; Jourdain, Anne; Tabuchi, Tomotaka; Leunissen, Peter (2012) -
Demonstration of ultra-thin Si grinding process controlled by in-situ non-contact gauge for 3D stacked IC (3D-SIC)
Zhao, Ming; Verbinnen, Greet; Yoshida, Shinji; Hayakawa, Susumu; Tabuchi, Tomotaka; Jourdain, Anne; Beyne, Eric; Swinnen, Bart; Leunissen, Peter (2010) -
Design and Optimization of SRAM Macro and Logic Using Backside Interconnects at 2nm node
Chen, Rongmei; Sisto, Giuliano; Jourdain, Anne; Hiblot, Gaspard; Stucchi, Michele; Kakarla, Naveen; Chehab, Bilal; Salahuddin, Shairfe Muhammad; Schleicher, Filip; Veloso, Anabela; Hellings, Geert; Weckx, Pieter; Milojevic, Dragomir; Van der Plas, Geert; Ryckaert, Julien; Beyne, Eric (2021) -
Design considerations and technology assessment of phased-array antenna systems with RF-MEMS for automotive radar applications
Schoebel, Joerg; Buck, Tomas; Reimann, Matthias; Ulm, Markus; Schneider, Martin; Jourdain, Anne; Carchon, Geert; Tilmans, Harrie (2005) -
Development of integrated wet cleans for 3D-SIC technologies
Suhard, Samuel; Simms, Ihsan; Brown, Ian; Shogo, Mizota; Koji, Kagawa; Claes, Martine; Buisson, Thibault; Jourdain, Anne; Beyer, Gerald; De Gendt, Stefan (2013) -
Development of multi-stack dielectric wafer bonding
Peng, Lan; Kim, Soon-Wook; Inoue, Fumihiro; Wang, Teng; Phommahaxay, Alain; Verdonck, Patrick; Jourdain, Anne; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyer, Gerald; Beyne, Eric; Soules, Mike; Lutter, Stefan (2016) -
Die to wafer 3D stacking for below 10μm pitch microbumps
Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Suhard, Samuel; Dubey, Vikas; Jamieson, Geraldine; Inoue, Fumihiro; Webers, Tomas; Bex, Pieter; Capuz, Giovanni; Beyne, Eric; Slabbekoorn, John; Wang, Teng; Jourdain, Anne; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy (2016) -
Direct Bonding Using Low Temperature SiCN Dielectrics
Iacovo, Serena; Nagano, Fuya; Channam, Venkat Sunil Kumar; Walsby, Edward; Crook, Kath; Buchanan, Keith; Jourdain, Anne; Vanstreels, Kris; Phommahaxay, Alain; Beyne, Eric (2022)