Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration

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Authors
Wostyn, Kurt; Zhao, Ming; Cui, Hushan; Laermans, Patrick; Jourdain, Anne; Verbinnen, Greet; Struyf, Herbert; De Strycker, Steven; Claes, Martine; Travaly, Youssef; Leunissen, Peter
Conference
10th International Symposium on Ultra-Clean Processing of Semiconductor Devices - UCPSS
Title
Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration
Publication type
Meeting abstract
Embargo date
9999-12-31
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