Publication:

Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration

Date

2010
Meeting abstract
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dc.contributor.authorWostyn, Kurt
dc.contributor.authorZhao, Ming
dc.contributor.authorCui, Hushan
dc.contributor.authorLaermans, Patrick
dc.contributor.authorJourdain, Anne
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorStruyf, Herbert
dc.contributor.authorDe Strycker, Steven
dc.contributor.authorClaes, Martine
dc.contributor.authorTravaly, Youssef
dc.contributor.authorLeunissen, Peter
dc.contributor.imecauthorWostyn, Kurt
dc.contributor.imecauthorZhao, Ming
dc.contributor.imecauthorLaermans, Patrick
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorClaes, Martine
dc.contributor.orcidimecWostyn, Kurt::0000-0003-3995-0292
dc.contributor.orcidimecZhao, Ming::0000-0002-0856-851X
dc.date.accessioned2021-10-19T00:37:10Z
dc.date.available2021-10-19T00:37:10Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18371
dc.source.beginpage188
dc.source.conference10th International Symposium on Ultra-Clean Processing of Semiconductor Devices - UCPSS
dc.source.conferencedate19/09/2010
dc.source.conferencelocationOostende Belgium
dc.source.endpage189
dc.title

Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration

dc.typeMeeting abstract
dspace.entity.typePublication
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