Publication:

Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration

Date

2010
Meeting abstract
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Author(s)

Wostyn, Kurt  
;
Zhao, Ming  
;
Cui, Hushan
;
Laermans, Patrick  
;
Jourdain, Anne  
;
Verbinnen, Greet  
;
Struyf, Herbert  
;
De Strycker, Steven
;
Claes, Martine  
;
Travaly, Youssef
;
Leunissen, Peter

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