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Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration
Publication:
Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration
Date
2010
Meeting abstract
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21236.pdf
344.49 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wostyn, Kurt
;
Zhao, Ming
;
Cui, Hushan
;
Laermans, Patrick
;
Jourdain, Anne
;
Verbinnen, Greet
;
Struyf, Herbert
;
De Strycker, Steven
;
Claes, Martine
;
Travaly, Youssef
;
Leunissen, Peter
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Abstract
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1933
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations
Metrics
Views
1933
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations