Authors

Zhao, Ming; Hayakawa, Susumu; Nishida, Yoshiteru; Jourdain, Anne; Tabuchi, Tomotaka; Leunissen, Peter

Conference

4th Electronics System Integration Technology Conference - ESTC

Title

Demonstration of integrating post-thinning clean and TSV exposure recess etch into a wafer backside thinning process

Publication type

Proceedings paper