Publication:

Demonstration of integrating post-thinning clean and TSV exposure recess etch into a wafer backside thinning process

Date

2012
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorZhao, Ming
dc.contributor.authorHayakawa, Susumu
dc.contributor.authorNishida, Yoshiteru
dc.contributor.authorJourdain, Anne
dc.contributor.authorTabuchi, Tomotaka
dc.contributor.authorLeunissen, Peter
dc.contributor.imecauthorZhao, Ming
dc.contributor.imecauthorJourdain, Anne
dc.contributor.orcidimecZhao, Ming::0000-0002-0856-851X
dc.date.accessioned2021-10-20T19:41:53Z
dc.date.available2021-10-20T19:41:53Z
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21931
dc.source.conference4th Electronics System Integration Technology Conference - ESTC
dc.source.conferencedate17/09/2012
dc.source.conferencelocationAmsterdam The Netherlands
dc.title

Demonstration of integrating post-thinning clean and TSV exposure recess etch into a wafer backside thinning process

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions