Authors

Zhao, Ming; Verbinnen, Greet; Yoshida, Shinji; Hayakawa, Susumu; Tabuchi, Tomotaka; Jourdain, Anne; Beyne, Eric; Swinnen, Bart; Leunissen, Peter

Conference

7th Annual International Wafer-Level Packaging Conference

Title

Demonstration of ultra-thin Si grinding process controlled by in-situ non-contact gauge for 3D stacked IC (3D-SIC)

Publication type

Proceedings paper